Thermal Shock Chambers
Detect product flaws before they reach your customer
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
These thermal shock chambers are engineered to evaluate how products withstand sudden, extreme temperature changes. By rapidly transferring test samples between hot and cold zones, these systems expose material weaknesses, solder joint failures, seal degradation, and other latent defects that can compromise long-term reliability.
Our thermal shock chambers are designed to support testing in accordance with widely recognized specifications, including:
- JESD22-A104 – Temperature Cycling / Thermal Shock for semiconductor devices
- IEC 60068-2-14 – Change of temperature testing for electronic equipment
- MIL-STD-883, Method 1010 – Thermal shock testing for microelectronic devices
- MIL-STD-202, Method 107 – Thermal shock for electronic and electrical components
- MIL-STD-810, Method 503 – Temperature shock for military equipment
Find the Right Thermal Shock Chamber for Your Application
Our thermal shock chambers are available in small compact to large-capacity systems, including vertical air-to-air two-zone, horizontal two or three zone and liquid-to-liquid two-zone configurations, providing flexible solutions for R&D, qualification testing, production screening, and compliance verification.
