VTS-Series Thermal Shock Chamber Options

Listed below are the options that are available on VTS-Series thermal shock chambers.
Cabinet Options / Instrumentation Options / Performance & Refrigeration Options

Cabinet Options

Compressed Air Supply

Self-contained air supply for to operate transfer carriage in the event a facility air supply is not available.

Upstream/Downstream Sensors

Selector switches available for upstream/downstream air flow option to meet various test standard requirements.

Traveling Cable Ports

Larger cable ports available in place of standard size port for ease of cable routing

Viewing Window with light

Window available in upper chamber to view product under test. Window is standard on VTS-9 model.

Stainless Steel Basket with Support Rails

Additional or spare product baskets with support rails are available and may be sized to your specifications.

Instrumentation Options

EZ-View Chamber SoftwareWindows-Based Software Package

CSZ EZ-View software is available for monitoring and controlling up to 20 chambers from any location.


Chamber Hi-Low LimitRedundant Temperature Limit & Alarm

Provides essential failsafe over/under (hi/low) temperature protection for your valuable test items.



IEEE InterfaceIEEE-488 Computer Interface

A parallel interface can be provided for interface with IEEE-488 parallel instrument control buss. A standard IEEE-488 connector is provided for easy connection to adjacent test equipment. This option cannot be used in conjunction with RS-232/RS-485 communications.


Chart RecorderChart Recorders

A selection of one or two pen chart recorders are available with a variety of pre-printed charts or self printing thermal charts.


Run Time MeterRunning Time Meter

The optional run time meter includes a non-resettable display which will accumulate the system running time for routine maintenance and planning purposes.


Main Power DisconnectMain Power Disconnect

Provides an additional level of safety by shutting down the main power to the chamber prior to maintenance or repair.


Customer Event OptionCustomer Event Option (Digital Outputs)

Includes 15 event outputs with connection panel & removable plug connectors. Designed to turn customer’s electronic DUT’s (devices under test) ON or OFF at various stages of the customer programmed test profile. Each output may also be configured to perform other operations including alarm or profile status indicators.


Digital Input OptionDigital Input Option

Includes connection panel and 8 inputs that can be configured to perform various controller functions (i.e. start, hold, resume or terminate a profile, advance steps, control customer event outputs, etc.)


EZT Monitor OptionEZT Monitor Package (provides 8 thermocouple / TC inputs through EZT-570i)

Designed to consist of eight (8) “T” type thermocouples (TC’s) for temperature readout with individual alarms, displays, and data logging for each input that can be monitored by the EZT-570i and the EZ-View software. The “black-box” unit itself will be mounted to the side or rear of the unit and the eight TC’s will pass through one of the existing side ports. These are TC’s only (no RH sensors or PT100-RTD’s) and are used for product temperature monitoring or temperature uniformity check within the chamber. (For monitoring only, no control.)

Watlow F4 ControllerOptional F4 Controller

CSZ F4 Programmable Controller with Product Monitor, redundant high/low limit and EIA 232/485 Computer Interface. Replaces EZT-570i controller.

Performance & Refrigeration Options

LN2 Boost OptionCO2/LN2 Boost Cooling (Direct Injection)

Boost cooling is available for applications that require a fast pulldown rate. An LN2 supply tank is required with a pressure of 25 psi.


CO2/LN2 Cooling Only (Direct Injection)

CO2/LN2 cooled chambers are available without mechanical refrigeration for lower initial costs on applications requiring ultra low temperatures down to -184°C (-300°F). An LN2 supply tank is required with a pressure of 25 psi.



Dry Air Purge Dry Air Purge System

A dry air purge system can be provided to reduce condensation within the chamber and on the test item during temperature cycling testing. This option is primarily used to prevent short circuits in electronic components.